projects

several projects in the fields of surface analysis, thermal and electrical characterisation of new materials, >20 completed projects

labs

Electronic Components, Scanning Probe Microscopy (SPM), Scanning Electron Microscopy (SEM) and Semiconductor Analytics

core competencies

Materials- and Surface Analysis

* Scanning Electron Microscopy & Related Methods

X-ray analytics (EDX, WDX), structure and microstructure analytics (EBSD), micro X-ray fluorescence (μ-XRF) scanning transmission electron microscopy (STEM), correlative microscopy

* Scanning Probe Microscopy & Laser-Scanning Microscopy

combined mechanical, magnetic, electric, thermal and chemical microcharacterisation

* Thermal Characterisation

Quality Assurance and Reliability Analytics

error and failure analytics, semiconductor wafer level tests and lifetime calculations

Vita

Academic History

Present rank: Professor, Deggendorf Institute of Technology, 1998 Ph.D.: Technical University of Munich, 1994 University degree: Electrical Engineering, Technical University of Munich, 1989

Employment History

1989-1994: Research assistant, Technical University of Munich 1994-1998: Siemens, IBM/Siemens/Toshiba DRAM – Project in Burlington, Vermont, USA 1998-present: Professor, Deggendorf Institute of Technology, Faculty of Electrical Engineering and Media Technology, Head of Institute for Quality and Materials Analysis (IQMA)

Other

Associate Editor of Microelectronic Engineering (Elsevier)